www.jstmtz.com

Precision Diamond Wire for Silicon Cutting  

Precision Diamond Wire for Silicon Cutting

Precision Diamond Wire for Silicon Cutting For the slice processing method used for electronic materials, we expedite transition from a conventional free abrasive grain method to a fixed abrasive grain method. The fixed abrasive grain method enables higher production capacity and eases environmental strain for a revolutionary improvement in slice processing of electronic materials.Our high-speed, high-strength diamond fixation technology enables us to produce our diamond saw cutting wire with high-efficiency at a low cost. Parameters: NO. Size Core Wire(mm) Emery Granularity(μm) Diamete range(mm) Broken Puling Force(N) 1 0.35 0.25 40-50 0.330-0.360 ≧160…