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Ceramic Bond Diamond Wheel For Electronic Ceramic Lapping

Ceramic Bond Diamond Wheel For Electronic Ceramic Lapping

1000 outer diameter grinding zinc oxide resistor special ceramic diamond grinding disc   Type of binder: Ceramic   Abrasive type: Diamond D   Shape: 1A2T cylindrical grinding block   Diameter: 1000mm, 1050mm   Inner hole: 380mm, 450mm, 400mm   Ring width: 310mm, 275mm, 325mm   Ring thickness: 6mm, 8mm, 10mm can be customized   Granularity: 80 # -2000#   Product features: high grinding efficiency, long service life, wide applicability, strong universality, high precision, and good surface quality of the processed workpiece (high flatness and smoothness).   Scope of application:   CNC blades: hard alloy, metal ceramic, ceramic, CBN blades;   Industrial ceramics: oxide and non oxide ceramic products such as alumina, zirconia, indium oxide, silicon nitride, boron nitride, etc;   Magnetic materials: 3C, automotive magnetic material products;   Powder metallurgy: gears, hardware, etc;   Automotive components: rotor, stator;   Hydraulic components: plunger pump, vane pump, hydraulic motor co…