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CSOP28 Ceramic Compact Housings  

CSOP28 Ceramic Compact Housings

An integrated circuit enclosure, also known as an integrated circuit package, is a protective shell used to safeguard integrated circuit chips in consumer electronics. These packages, such as the dual inline housing and complex integrated circuit package, are typically constructed from plastic or ceramic materials. These materials possess excellent insulating properties, effectively shielding the integrated circuit from external electromagnetic radiation and electrostatic interference. Furthermore, plastic  housings offer advantages such as lower cost and lighter weight, facilitating the manufacturing and utilization of integrated circuits. One crucial aspect of IC housing design is heat dissipation. Integrated circuits generate heat during operation, and without proper dissipation, excessive temperatures can impact circuit performance and lifespan. To address t his, IC housings are often equipped with heat dissipation structures like heat sinks, heat sink holes, or heat…